The reliability of 0·5 mm pitch, 208‐pin FQFP solder joints has been studied by experimental temperature cycling and 3‐D nonlinear finite element analysis. Temperature cycling results have been presented as a Weibull distribution. Thermal fatigue life of the solder joints has been estimated based on the calculated plastic strain and isothermal fatigue data on solders. A correlation between the experimental and analytical results has also been made.
Lau, J., Dody, G., Chen, W., McShane, M., Rice, D., Erasmus, S. and Adamjee, W. (1992), "Analytical and Experimental Studies of 208‐pin Fine Pitch (0·5 mm) Quad Flat Pack Solder‐joint Reliability", Circuit World, Vol. 18 No. 2, pp. 13-19. https://doi.org/10.1108/eb046154
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