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Analytical and Experimental Studies of 208‐pin Fine Pitch (0·5 mm) Quad Flat Pack Solder‐joint Reliability

J. Lau (Hewlett‐Packard Company, Palo Alto, CA, USA)
G. Dody (Motorola Inc., Austin, TX, USA)
W. Chen (Motorola Inc., Austin, TX, USA)
M. McShane (Motorola Inc., Austin, TX, USA)
D. Rice (Hewlett‐Packard Company, Palo Alto, CA, USA)
S. Erasmus (Hewlett‐Packard Company, Palo Alto, CA, USA)
W. Adamjee (Motorola Inc., Austin, TX, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 January 1992

29

Abstract

The reliability of 0·5 mm pitch, 208‐pin FQFP solder joints has been studied by experimental temperature cycling and 3‐D nonlinear finite element analysis. Temperature cycling results have been presented as a Weibull distribution. Thermal fatigue life of the solder joints has been estimated based on the calculated plastic strain and isothermal fatigue data on solders. A correlation between the experimental and analytical results has also been made.

Citation

Lau, J., Dody, G., Chen, W., McShane, M., Rice, D., Erasmus, S. and Adamjee, W. (1992), "Analytical and Experimental Studies of 208‐pin Fine Pitch (0·5 mm) Quad Flat Pack Solder‐joint Reliability", Circuit World, Vol. 18 No. 2, pp. 13-19. https://doi.org/10.1108/eb046154

Publisher

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MCB UP Ltd

Copyright © 1992, MCB UP Limited

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