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Polymer Thick Film Technology in Telecommunication Applications

J. Cavero (Telefonica Investigation y Desarrollo, Madrid, Spain)
A. Rodriguez (Telefonica Investigation y Desarrollo, Madrid, Spain)

Circuit World

ISSN: 0305-6120

Article publication date: 1 April 1991

Abstract

This paper concisely describes polymer thick film technology used with printed circuit boards as an interesting means of achieving time and cost reduction. Telephone keypads and edge connectors manufactured with this technology and using two different processes are subjected to environmental and life tests in order to compare them with the traditional gold‐plated keypads and edge connectors used in the same applications.

Citation

Cavero, J. and Rodriguez, A. (1991), "Polymer Thick Film Technology in Telecommunication Applications", Circuit World, Vol. 18 No. 1, pp. 14-21. https://doi.org/10.1108/eb046149

Publisher

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MCB UP Ltd

Copyright © 1991, MCB UP Limited