TY  - JOUR
AB  - Continuously increasing requirements drive multilayer manufacturers to search for advanced manufacturing technologies and to evaluate new materials. This paper provides an insight into new multilayer bonding methods, improvements offered by laminators, and why to select high performance materials for special applications.
VL  - 18
IS  - 1
SN  - 0305-6120
DO  - 10.1108/eb046148
UR  - https://doi.org/10.1108/eb046148
AU  - Huschka M.
PY  - 1991
Y1  - 1991/01/01
TI  - Advanced Multilayer Bonding Technology
T2  - Circuit World
PB  - MCB UP Ltd
SP  - 9
EP  - 13
Y2  - 2024/04/25
ER  -