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Advanced Multilayer Bonding Technology

M. Huschka (Norplex Oak Europa, Wipperfürth, Germany)

Circuit World

ISSN: 0305-6120

Article publication date: 1 April 1991

Abstract

Continuously increasing requirements drive multilayer manufacturers to search for advanced manufacturing technologies and to evaluate new materials. This paper provides an insight into new multilayer bonding methods, improvements offered by laminators, and why to select high performance materials for special applications.

Citation

Huschka, M. (1991), "Advanced Multilayer Bonding Technology", Circuit World, Vol. 18 No. 1, pp. 9-13. https://doi.org/10.1108/eb046148

Publisher

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MCB UP Ltd

Copyright © 1991, MCB UP Limited