Investigation of Copper Deposition on Printed Circuit Boards Using Taguchi Methods

Abstract

This study describes how the copper deposition rate and the degree of copper coverage in the holes on printed circuit boards were investigated. The composition of the chemical copper solution was varied, and consequently the deposition parameters were changed. By using Taguchi methods, the level of significance of the process parameters was determined.

Citation

Halužan, I. and Reichenbach, D. (1991), "Investigation of Copper Deposition on Printed Circuit Boards Using Taguchi Methods", Circuit World, Vol. 17 No. 4, pp. 24-26. https://doi.org/10.1108/eb046144