PWB Interconnect Strategy Using a Full Build Electroless Copper Plating System

Abstract

Two current full build electroless copper deposits were investigated. This paper demonstrates that there are fundamental differences in the nature of their deposits. The consequences of these differences are highlighted for the PWB manufacturer.

Citation

Minten, K. and Toth, J. (1991), "PWB Interconnect Strategy Using a Full Build Electroless Copper Plating System", Circuit World, Vol. 17 No. 4, pp. 19-26. https://doi.org/10.1108/eb046143