TY  - JOUR
AB  - In this study, the reliability of solder joints and plated‐through hole copper pads/barrels of pin grid array assemblies under rework condition has been determined by fatigue experiments. The cross‐sections of the re‐worked PGA assemblies (before and after fatigue tests) are also provided for a better understanding of the failure mechanisms of the composite structure. Furthermore, the load‐drop curves of the PGA interconnects for up to three reworks are provided for a better estimate of their fatigue life.
VL  - 17
IS  - 4
SN  - 0305-6120
DO  - 10.1108/eb046140
UR  - https://doi.org/10.1108/eb046140
AU  - Lau J.
AU  - Leung S.
AU  - Subrahmanyan R.
AU  - Rice D.
AU  - Erasmus S.
AU  - Li C.Y.
PY  - 1991
Y1  - 1991/01/01
TI  - Effects of Rework on the Reliability of Pin Grid Array Interconnects
T2  - Circuit World
PB  - MCB UP Ltd
SP  - 5
EP  - 10
Y2  - 2024/04/19
ER  -