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Effects of Rework on the Reliability of Pin Grid Array Interconnects

J. Lau (Hewlett‐Packard Company, Palo Alto, California, USA)
S. Leung (Hewlett‐Packard Company, Palo Alto, California, USA)
R. Subrahmanyan (Motorola, Inc., Phoenix, Arizona, USA)
D. Rice (Hewlett‐Packard Company, Palo Alto, California, USA)
S. Erasmus (Hewlett‐Packard Company, Palo Alto, California, USA)
C.Y. Li (Department of Material Science and Engineering, Cornell University, Ithaca, New York, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 March 1991

Abstract

In this study, the reliability of solder joints and plated‐through hole copper pads/barrels of pin grid array assemblies under rework condition has been determined by fatigue experiments. The cross‐sections of the re‐worked PGA assemblies (before and after fatigue tests) are also provided for a better understanding of the failure mechanisms of the composite structure. Furthermore, the load‐drop curves of the PGA interconnects for up to three reworks are provided for a better estimate of their fatigue life.

Citation

Lau, J., Leung, S., Subrahmanyan, R., Rice, D., Erasmus, S. and Li, C.Y. (1991), "Effects of Rework on the Reliability of Pin Grid Array Interconnects", Circuit World, Vol. 17 No. 4, pp. 5-10. https://doi.org/10.1108/eb046140

Publisher

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MCB UP Ltd

Copyright © 1991, MCB UP Limited