New Polymeric Multilayer Substrates and Packaging

Abstract

This paper reports on the development of a simple manufacturing process for polymeric multilayer substrates utilising the thermoplasticity of thermoplastic resin. Features and defects noted in manufacturing trials of the substrates are also reported. The process involves a polymer‐based thick film conductive paste screen printed on a hole‐punched thermoplastic resin film and dried. The films are stacked to form multiple layers and are then compressed into one unit. As the extremely thin thermoplastic resin film layers are equivalent to a single layer, a feature of this substrate is its exceptional thinness. As thermoplastic resin is used as a base material, the soldering process and other connecting technologies which may be used in place of solder connection are also examined.

Citation

Ohdaira, H., Yoshida, K. and Sasaoka, K. (1991), "New Polymeric Multilayer Substrates and Packaging", Circuit World, Vol. 17 No. 2, pp. 21-25. https://doi.org/10.1108/eb046124