TY  - JOUR
AB  - This paper discusses the increasing activity being directed towards microminiature multichip module packaging. It shows new substrate materials that are being investigated, including multilayer thin‐film ceramics and silicon wafers. Wire bonding, tape‐automated bonding (TAB), and flip device termination techniques are covered. Particular attention is given to the use of multichip modules for advanced data processing applications.
VL  - 17
IS  - 1
SN  - 0305-6120
DO  - 10.1108/eb046106
UR  - https://doi.org/10.1108/eb046106
AU  - Ginsberg G.L.
PY  - 1990
Y1  - 1990/01/01
TI  - Multichip Modules for Advanced Applications
T2  - Circuit World
PB  - MCB UP Ltd
SP  - 5
EP  - 9
Y2  - 2024/05/07
ER  -