Wave Soldering of SMDs—A Smart Approach From Science to Practice
G. Schouten
(Soltec BV, Oosterhout, The Netherlands)
33
Abstract
This paper describes some fundamental aspects involved in wave soldering of surface mount devices. Calculations are given on capillary behaviour to provide a greater understanding of the problems involved in wetting SMDs. The soldering of SMDs with a new single wave soldering concept will also be featured.
Citation
Schouten, G. (1988), "Wave Soldering of SMDs—A Smart Approach From Science to Practice", Circuit World, Vol. 14 No. 3, pp. 41-44. https://doi.org/10.1108/eb046018
Publisher
:MCB UP Ltd
Copyright © 1988, MCB UP Limited