Metal Cored Printed Circuit Boards

Abstract

Close spacing of conductors, surface mounted components and a multiplicity of DIPs have rendered the use of heat sinks on the PC board surface more and more hazardous. Where exposure to extreme temperatures is likely, the bond of heat sinks to the board has failed in 8% of cases during a recent investigation. Using the techniques described in this paper, any company with a multilayer manufacturing capability can produce a printed circuit board with good thermal conductivity and expansion characteristics related to most component mounting devices.

Citation

Shemilt, H.R. (1983), "Metal Cored Printed Circuit Boards", Circuit World, Vol. 10 No. 1, pp. 28-31. https://doi.org/10.1108/eb045975