Fine Pitch Wire Bonding for µBGA™ Packages
Z. Kovac
(Tessera, Inc., San Jose, California, USA)
T.H. DiStefano
(Tessera, Inc., San Jose, California, USA)
J. Grange
(Tessera, Inc., San Jose, California, USA)
I. Alfonso
(Tessera, Inc., San Jose, California, USA)
42
Citation
Kovac, Z., DiStefano, T.H., Grange, J. and Alfonso, I. (1995), "Fine Pitch Wire Bonding for µBGA™ Packages", Microelectronics International, Vol. 12 No. 3, pp. 44-46. https://doi.org/10.1108/eb044584
Publisher
:Emerald Group Publishing Limited
Copyright © 1995, Emerald Group Publishing Limited