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A Novel Composite Material for Electronic Packaging

J.-M. Ting (Applied Sciences, Inc., Cedarville, Ohio, USA)

M.L. Lake (Applied Sciences, Inc., Cedarville, Ohio, USA)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 September 1995

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Citation

Ting, J.-.-M. and Lake, M.L. (1995), "A Novel Composite Material for Electronic Packaging", Microelectronics International, Vol. 12 No. 3, pp. 30-31. https://doi.org/10.1108/eb044583

Publisher

:

Emerald Group Publishing Limited

Copyright © 1995, Emerald Group Publishing Limited

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