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Influence of Composition and Construction Parameters on the Basic Properties of Thick Film Thermistors

L. Golonka (Institute of Electron Technology, Technical University of Wroclaw, Wroclaw, Poland)
J. Kozlowski (Institute of Electron Technology, Technical University of Wroclaw, Wroclaw, Poland)
B.W. Licznerski (Institute of Electron Technology, Technical University of Wroclaw, Wroclaw, Poland)
K. Nitsch (Institute of Electron Technology, Technical University of Wroclaw, Wroclaw, Poland)
A. Seweryn (Institute of Electron Technology, Technical University of Wroclaw, Wroclaw, Poland)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 February 1992

Abstract

This paper presents experimental data associated with the properties of thick film thermistors based on a spinel‐type semiconducting oxide/RuO2/glass system. The following parameters—sheet resistivity, thermistor (B) and thermal time (?) constants—have been measured, all as functions of different composition and construction variants. The thermistor properties are independent of configuration and are mainly determined by the semiconducting oxide particle chains. The correlation between B and ? for the compositions considered has been observed.

Citation

Golonka, L., Kozlowski, J., Licznerski, B.W., Nitsch, K. and Seweryn, A. (1992), "Influence of Composition and Construction Parameters on the Basic Properties of Thick Film Thermistors", Microelectronics International, Vol. 9 No. 2, pp. 9-12. https://doi.org/10.1108/eb044568

Publisher

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MCB UP Ltd

Copyright © 1992, MCB UP Limited