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The Effect of Moisture on Die Attach Joints Made with Silver Filled Epoxy

O. Rusanen (VTT Electronics, Oulu, Finland)

J. Lenkkeri (VTT Electronics, Oulu, Finland)

L. Kivimaäki (VTT Electronics, Oulu, Finland)

ISSN: 1356-5362

Article publication date: 1 May 1995

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Rusanen, O., Lenkkeri, J. and Kivimaäki, L. (1995), "The Effect of Moisture on Die Attach Joints Made with Silver Filled Epoxy", Microelectronics International, Vol. 12 No. 2, pp. 25-27. https://doi.org/10.1108/eb044561

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