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Evaluating a Thick Film System for All Ag and for Pd/Ag, Au ‘Mixed Metallurgy’ Multilayer Applications

P. Baumbach (ESL Europe/Agmet Ltd, Reading, Berkshire, England)
M. Bilinski (ESL Europe/Agmet Ltd, Reading, Berkshire, England)
J. Whitmarsh (ESL Europe/Agmet Ltd, Reading, Berkshire, England)
J. Lorenz (Electro-Science Laboratories, Inc., Portland, Oregon, USA)
P. Bless (Electro-Science Laboratories, Inc., Portland, Oregon, USA)
M.A. Stein (Electro-Science Laboratories, Inc., Portland, Oregon, USA)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 May 1995

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Citation

Baumbach, P., Bilinski, M., Whitmarsh, J., Lorenz, J., Bless, P. and Stein, M.A. (1995), "Evaluating a Thick Film System for All Ag and for Pd/Ag, Au ‘Mixed Metallurgy’ Multilayer Applications", Microelectronics International, Vol. 12 No. 2, pp. 18-21. https://doi.org/10.1108/eb044559

Publisher

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Emerald Group Publishing Limited

Copyright © 1995, Emerald Group Publishing Limited

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