Resist Coating of Cylindrical Samples for 3‐D Lithography
C.G. Giaconia
(Dipartimento di Ingegneria Elettrica, Università di Palermo, Palermo, Italy)
G. Grasso
(Dipartimento di Ingegneria Elettrica, Università di Palermo, Palermo, Italy)
C. Arnone
(Dipartimento di Ingegneria Elettrica, Università di Palermo, Palermo, Italy)
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Abstract
A quantitative investigation of a dipping technique for depositing a thin layer of resist on circularly symmetrical objects is presented. The results obtained are valuable for preparing three‐dimensional (3‐D) surfaces suited for spatial microlithographic processes in the 1 to 10 µm linewidth range.
Citation
Giaconia, C.G., Grasso, G. and Arnone, C. (1995), "Resist Coating of Cylindrical Samples for 3‐D Lithography", Microelectronics International, Vol. 12 No. 1, pp. 22-24. https://doi.org/10.1108/eb044552
Publisher
:MCB UP Ltd
Copyright © 1995, MCB UP Limited