A Cost‐effective High Efficiency LED Array Assembly Using Insulated Metal Substrates and Low Thermal Impedance SM Diode Encapsulation
H. Sawa
(Omuta Factory, Denki Kagaku Kogyo, Kumamoto, Japan)
K. Kato
(Research Center, Denki Kagaku Kogyo, Tokyo, Japan)
S. Asai
(Research Center, Denki Kagaku Kogyo, Tokyo, Japan)
78
Abstract
A surface‐mount in‐line light emitting diode (LED) array was developed for mounting an LED dot matrix display on a single‐sided insulated metal substrate (IMS). This LED array has heat dissipating cathode leads and an anode lead that works as a jumper wire. Good heat dissipation of the LED array was obtained on an aluminium IMS.
Citation
Sawa, H., Kato, K. and Asai, S. (1994), "A Cost‐effective High Efficiency LED Array Assembly Using Insulated Metal Substrates and Low Thermal Impedance SM Diode Encapsulation", Microelectronics International, Vol. 11 No. 3, pp. 5-8. https://doi.org/10.1108/eb044536
Publisher
:MCB UP Ltd
Copyright © 1994, MCB UP Limited