To read the full version of this content please select one of the options below:

ISHM news

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 February 1994

40

Abstract

‘The Choice between Chip and Wire and High Density Surface Mount Packages (MCM‐X, COB, etc.)’ was the title of the above event. One of a regular series held by ISHM‐France, this technical seminar was attended by over 100 members and non‐members of ISHM who were eager to hear of the latest developments in the field of multichip modules. The eight papers presented are summarised below:

Citation

Hilley, A.P., Binner, H. and Sung Oh, T. (1994), "ISHM news", Microelectronics International, Vol. 11 No. 2, pp. 53-57. https://doi.org/10.1108/eb044534

Publisher

:

MCB UP Ltd

Copyright © 1994, MCB UP Limited

Related articles