Trends in MCM and Electronics Assembly

Abstract

This paper looks at the progress taking place in packaging and assembly, with particular emphasis on the introduction of three‐dimensional IC technology. The progression from DIP to SMT and then MCM is seen as a natural one with a further progression to 3‐dimensional packaging already under way. The interdependence of device, process and packaging technology is analysed and examples of 3‐dimensional packaging are discussed.

Citation

Sage, M.G. and Gross, D.R. (1994), "Trends in MCM and Electronics Assembly", Microelectronics International, Vol. 11 No. 2, pp. 31-32. https://doi.org/10.1108/eb044531