MCM‐L Technology

Abstract

Multichip modules using lamination techniques to make the substrate (MCM‐Ls) are a natural extension of printed circuit technology to meet the ever increasing demands of system integration and density. As with other forms of MCM, the interconnection density is so high that many circuits need only two signal layers. The substrate can also incorporate layers to control thermal expansion and extract heat. MCM‐L substrates are extraordinarily versatile; they can accommodate packaged ICs (e.g., fine pitch SMT), unpackaged ICs, other MCMs and odd‐form components. There is a large and growing number of MCM‐L suppliers offering solutions for a wide range of sizes, complexities, performance and market sectors at competitive prices.

Citation

Chandler, N. and Tyler, S.G. (1994), "MCM‐L Technology", Microelectronics International, Vol. 11 No. 2, pp. 14-19. https://doi.org/10.1108/eb044527