TY  - JOUR
AB  - This paper describes some of the benefits of electronic packages manufactured from silicon carbide reinforced aluminium composites. The housings which were analysed and tested consisted of iron‐nickel alloy sidewalls soldered to composite bases. The metal matrix composite bases were produced using Lanxide's PRIMEX™ pressureless metal infiltration process. Hermeticity test results on the base to sidewall seals are presented along with comparative electrical performance of the composite versus conventional base materials. Analysis of the thermal, mechanical and weight performance of this approach is also provided.
VL  - 11
IS  - 1
SN  - 1356-5362
DO  - 10.1108/eb044516
UR  - https://doi.org/10.1108/eb044516
AU  - Keck S.
AU  - Leighton J.
AU  - Morgner R.
PY  - 1994
Y1  - 1994/01/01
TI  - New Composite Packaging
T2  - Microelectronics International
PB  - MCB UP Ltd
SP  - 8
EP  - 11
Y2  - 2024/04/23
ER  -