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New Composite Packaging

S. Keck (Lanxide Electronics Components, Newark, Delaware, USA)
J. Leighton (Lanxide Electronics Components, Newark, Delaware, USA)
R. Morgner (Balo Precision Parts, Butler, New Jersey, USA)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 January 1994



This paper describes some of the benefits of electronic packages manufactured from silicon carbide reinforced aluminium composites. The housings which were analysed and tested consisted of iron‐nickel alloy sidewalls soldered to composite bases. The metal matrix composite bases were produced using Lanxide's PRIMEX™ pressureless metal infiltration process. Hermeticity test results on the base to sidewall seals are presented along with comparative electrical performance of the composite versus conventional base materials. Analysis of the thermal, mechanical and weight performance of this approach is also provided.


Keck, S., Leighton, J. and Morgner, R. (1994), "New Composite Packaging", Microelectronics International, Vol. 11 No. 1, pp. 8-11.




Copyright © 1994, MCB UP Limited

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