Adhesives for Electronic Applications
Article publication date: 1 February 1993
This paper describes the results of an analysis carried out on thermally conductive and electrically conductive adhesives, in order to characterise their behaviour for electronics and telecommunications applications.
Adell, J.A., Molina, M. and Cavero, J.M. (1993), "Adhesives for Electronic Applications", Microelectronics International, Vol. 10 No. 2, pp. 54-56. https://doi.org/10.1108/eb044500
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