Adhesives for Electronic Applications
J.A. Adell
(Telefónica Research & Development, Madrid, Spain)
M. Molina
(Telefónica Research & Development, Madrid, Spain)
J.M. Cavero
(Telefónica Research & Development, Madrid, Spain)
243
Abstract
This paper describes the results of an analysis carried out on thermally conductive and electrically conductive adhesives, in order to characterise their behaviour for electronics and telecommunications applications.
Citation
Adell, J.A., Molina, M. and Cavero, J.M. (1993), "Adhesives for Electronic Applications", Microelectronics International, Vol. 10 No. 2, pp. 54-56. https://doi.org/10.1108/eb044500
Publisher
:MCB UP Ltd
Copyright © 1993, MCB UP Limited