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Sensitivity Analysis in the Determination of Thermal Parameters

M. Wiedemann (TU Berlin, Institut für Luft‐und Raumfahrt, Berlin, Germany)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 February 1993



This paper will describe how methods developed in structural dynamics may be used to solve a problem of microsystem technologies. In microsystem simulation, determination of the physical properties is of considerable interest. The method of thermal wave measurement is often used today to describe the thermal behaviour of microstructures. The simulation of thermal wave effects based on thermal mode vectors and followed by a sensitivity analysis enables the correction of primarily estimated thermal parameters by fitting calculated results with measured information. Model description and sensitivity analysis offer an effective tool for determining thermal parameters by thermal wave measurement in a fast and clear manner. Thermal wave measurement, simulation and sensitivity analysis together may be used for device design as well as for testing.


Wiedemann, M. (1993), "Sensitivity Analysis in the Determination of Thermal Parameters", Microelectronics International, Vol. 10 No. 2, pp. 29-32.




Copyright © 1993, MCB UP Limited

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