Vapour Phase Soldering and Removal of Flux Residues after Soldering in the Electronics Industry: Substitution of Organic Solvents
Article publication date: 1 January 1993
When providing substitutes for CFC‐113 in processes such as vapour phase soldering and removal of flux residues after soldering in the electronics industry, it is also important to avoid the use of other organic solvents at the same time. Vapour phase soldering can be replaced by soldering in an infra‐red belt oven or by using a closed wave soldering system with an inert gas such as nitrogen. The use of organic solvents in the removal of flux residues can be replaced by the following three procedures: eliminating removal, by using a flux with a low residue content; eliminating removal, by using a flux such as adipic acid (and formic acid) in a closed wave soldering system with an inert gas such as nitrogen; and removal with water using a water‐soluble flux.
Sørensen, F. and Styhr Petersen, H.J. (1993), "Vapour Phase Soldering and Removal of Flux Residues after Soldering in the Electronics Industry: Substitution of Organic Solvents", Microelectronics International, Vol. 10 No. 1, pp. 31-32. https://doi.org/10.1108/eb044489
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