The custom hybrid manufacturer must be able to offer the optimal multi‐chip module (MCM) solution from a portfolio of technologies. At present no single interconnect technology satisfies all the desired performance and cost requirements of the range of multi‐chip modules. Instead there is a hierarchy of interconnect technologies which offer various combinations of density, power handling, attenuation, signal transmission, testability and, of course, cost. Silicon hybrids have some specific merits and disadvantages which are discussed and compared with other technologies, such as fineline plated metal on ceramic (FPMC). Some examples are shown of the miniaturisation achieved. The silicon hybrids discussed use thin film interconnect with both conventional inorganic and the newer organic dielectrics.
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