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Thick‐film Hybrid Applications on Stainless Steel Baseplate

M. Lahdenperä (Technical Research Centre of Finland, Oulu, Finland)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 March 1991

Abstract

In this research work thick‐film manufacturing technology on stainless steel baseplates was developed. Adequate adhesion of dielectric IP211 to the steel substrate was achieved only by sand blast roughening. Standard PdAg thick‐film conductors were not solderable to IP211. The solution was to have a separate multilayer dielectric under conductors to be soldered. The reliability of soft soldering and gold wire bonding of thick‐film metallisation on stainless steel and other baseplate materials was evaluated. The technology developed was applied to manufacturing an intelligent signal node. Present expertise enables the manufacture of thick‐film hybrids on stainless steel baseplates. Development of an industrial production line would, however, involve considerable effort.

Citation

Lahdenperä, M. (1991), "Thick‐film Hybrid Applications on Stainless Steel Baseplate", Microelectronics International, Vol. 8 No. 3, pp. 26-31. https://doi.org/10.1108/eb044457

Publisher

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MCB UP Ltd

Copyright © 1991, MCB UP Limited