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Multi‐chip Modules for Telecom Applications

K. Gustafsson (Ericsson Telecom, Stockholm, Sweden)
G. Flodman (Ericsson Telecom, Stockholm, Sweden)
M. Bakszt (Ericsson Telecom, Stockholm, Sweden)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 February 1991

Abstract

System performance can be improved by the use of MCM (multi‐chip module) technology. Better signal transmission properties, lower power dissipation if C‐MOS chips are used and decreased physical volume will be obtained. Today MCM is an expensive technique, but the authors' cost analysis shows that it has the potential to become more cost‐effective than the standard technique of using single chip packages. It can also become more cost‐effective to use the MCM technique than to increase the number of gates on the silicon chip over a certain level. In order to study the properties of MCM technology, a project has been started at the authors' company in which a processor application is built up on three different types of MCM substrates.

Citation

Gustafsson, K., Flodman, G. and Bakszt, M. (1991), "Multi‐chip Modules for Telecom Applications", Microelectronics International, Vol. 8 No. 2, pp. 62-64. https://doi.org/10.1108/eb044448

Publisher

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MCB UP Ltd

Copyright © 1991, MCB UP Limited