TY  - JOUR
AB  - The reliability of thick film multilayer systems, based on palladium‐silver conductors, and obtained from several suppliers, is evaluated. A test structure is presented and the impact of different parameters, such as humidity, temperature, voltage bias and presence of overglaze, on the data is discussed. A SEM analysis of the failed samples allows identification of the failure mechanisms as due to flaws (pinholes and inclusions) in the dielectric.
VL  - 8
IS  - 2
SN  - 1356-5362
DO  - 10.1108/eb044444
UR  - https://doi.org/10.1108/eb044444
AU  - Vanden Berghe R.
AU  - Demolder S.
AU  - Saillé M.
AU  - Van Calster A.
AU  - Schotte H.
PY  - 1991
Y1  - 1991/01/01
TI  - Palladium/Silver Multilayers
T2  - Microelectronics International
PB  - MCB UP Ltd
SP  - 16
EP  - 20
Y2  - 2024/04/18
ER  -