The reliability of thick film multilayer systems, based on palladium‐silver conductors, and obtained from several suppliers, is evaluated. A test structure is presented and the impact of different parameters, such as humidity, temperature, voltage bias and presence of overglaze, on the data is discussed. A SEM analysis of the failed samples allows identification of the failure mechanisms as due to flaws (pinholes and inclusions) in the dielectric.
Vanden Berghe, R., Demolder, S., Saillé, M., Van Calster, A. and Schotte, H. (1991), "Palladium/Silver Multilayers", Microelectronics International, Vol. 8 No. 2, pp. 16-20. https://doi.org/10.1108/eb044444Download as .RIS
MCB UP Ltd
Copyright © 1991, MCB UP Limited