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Thermoelastic Problems for Electronic Packaging

J.H. Lau (Hewlett‐Packard Company, Palo Alto, California, USA)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 February 1991

Abstract

The basic equations (infinitesimal strain‐displacement relations, constitutive equation, conservation of mass, conservation of momentum, conservation of energy, rate of change of entropy, heat conduction equation, and definition of specific heat) and the governing equations (coupled, coupled‐quasi‐static, uncoupled‐quasi‐static, isotropic‐uncoupled‐quasi‐static and isotropic‐uncoupled‐steady) of thermoelasticity for a linear elastic package are briefly mentioned in the present study. The assumptions and limitations of these equations are also highlighted. Furthermore, two electronic packaging examples with closed form solutions using these equations are provided.

Citation

Lau, J.H. (1991), "Thermoelastic Problems for Electronic Packaging", Microelectronics International, Vol. 8 No. 2, pp. 11-15. https://doi.org/10.1108/eb044443

Publisher

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MCB UP Ltd

Copyright © 1991, MCB UP Limited