Packaging Options for High Lead Count ASIC Devices
S.T. Riches
(The Welding Institute, Abington, Cambridge, England)
21
Abstract
Selection of the correct interconnection technique for high lead count integrated circuits is dependent on technical and economic factors, in particular in small batch production of application specific devices (ASICs). This paper reviews some of the interconnection options and describes work where some advances in high density interconnection have been made.
Citation
Riches, S.T. (1990), "Packaging Options for High Lead Count ASIC Devices", Microelectronics International, Vol. 7 No. 3, pp. 14-21. https://doi.org/10.1108/eb044421
Publisher
:MCB UP Ltd
Copyright © 1990, MCB UP Limited