Assembly and Packaging Considerations for GaAs Microwave Power Devices

Abstract

Recent developments in microwave GaAs technology are yielding devices with higher power capabilities and increased levels of integration. The mechanical and thermal properties of GaAs and other microwave materials play a key role in the design and assembly of microwave power circuits. Thermal management is a critical element of microwave power circuit design. Thermal properties of microwave materials are discussed and compared with standard microelectronic materials. Material selection criteria are described. Assembly and packaging techniques also affect the overall performance of the GaAs power circuit. The high operating frequencies of microwave circuits make ordinary circuit elements, such as wire bonds and printed conductors, reactive. In addition, electrical performance criteria, such as high current or low impedance, create unique assembly demands. The successful development of a GaAs‐based microwave product is dependent on careful attention to the material properties and precise assembly methods. Techniques of automated assembly and processing are discussed, with ah eye towards maintaining high quality and reliability.

Citation

Tyler, J.R. and Andrade, D.K. (1989), "Assembly and Packaging Considerations for GaAs Microwave Power Devices", Microelectronics International, Vol. 6 No. 3, pp. 35-42. https://doi.org/10.1108/eb044387