Characterisation of Die Attach Adhesives
M. Remškar
(Iskra Kibernetika, Kranj, Yugoslavia)
D. Ročak
(Iskra Kibernetika, Kranj, Yugoslavia Institut Jožef Stefan, Ljubljana, Yugoslavia)
61
Abstract
Several commercially available epoxy and polyimide adhesives were tested. The properties essential for the use of adhesives in microelectronics are stated and their compliance with the requirements of standard MIL‐A‐87‐172 was evaluated.
Citation
Remškar, M. and Ročak, D. (1989), "Characterisation of Die Attach Adhesives", Microelectronics International, Vol. 6 No. 3, pp. 14-17. https://doi.org/10.1108/eb044383
Publisher
:MCB UP Ltd
Copyright © 1989, MCB UP Limited