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A Thick Film Materials System for the Manufacture of Advanced Hybrid Microcircuits

R. Gee (Du Pont (UK) Ltd, Stevenage, Hertfordshire, England)
M.V. Coleman (Du Pont (UK) Ltd, Stevenage, Hertfordshire, England STC Technology Ltd, Harlow, Essex, England)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 February 1989



The environmental reliability of Series Q, a system of materials designed for advanced ‘HIC’ circuits, has been studied using three different migration‐resistance tests. —LMRT: a test which is used to assess the resistance to electrochemical migration of horizontally adjacent, closely spaced conductor tracks in a high‐temperature, high‐humidity environment with a voltage bias present (60°C, 90%RH, 48 VDC). —HHBT: a test which monitors the ability of a dielectric to resist electrochemical migration when vertically adjacent crossover conductor tracks are oppositely biased (85°C, 85%RH, 5 VDC). —HBT: a test which measures how well a dielectric can sustain its resistance to voltage breakdown over extended periods of time during continuous exposure to conditions of high temperature and voltage (150°C, 200 VDC). The results show that the QSil™ and QPIus™ systems, the two materials systems that comprise Series Q, demonstrate excellent performance in all three areas. Predictions of how well circuits made from these materials will survive in their operating ambient over the long term, e.g., twenty years, have been made.


Gee, R. and Coleman, M.V. (1989), "A Thick Film Materials System for the Manufacture of Advanced Hybrid Microcircuits", Microelectronics International, Vol. 6 No. 2, pp. 23-28.




Copyright © 1989, MCB UP Limited

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