Some Adhesion Aspects of Thick Film Conductors

Abstract

An attempt is made to discuss the adhesion of thick film conductors on ceramic substrates in connection with thermally induced internal stresses caused by mismatch of the thermal expansion coefficient of the various layers and the substrate. The curvature of the bent substrates was taken as a measure of the internal stresses. A theoretical multilayer model is proposed for description of the composite — substrate/conductor/solder/intermetallic phases. This permits estimation of the stresses and the Young's modulus within the layers and explains the decrease of adhesion of the soldered copper layer after ageing.

Citation

Storbeck, I., Leitner, G., Wolf, M., Gottschalk, P. and Schläfer, U. (1989), "Some Adhesion Aspects of Thick Film Conductors", Microelectronics International, Vol. 6 No. 1, pp. 37-41. https://doi.org/10.1108/eb044357