Multichip Technology—Something for everyone?

Abstract

Each of the three major branches of interconnection technology has begun to focus its attention on Multichip Modules. The semiconductor manufacturers call the technology ‘The New Wafer Scale’ and use silicon‐on‐silicon constructions, but use organic insulating layers on the mother slice, permitting copper conductors instead of aluminium as used for the older silicon dioxide as the insulating material.

Citation

Balde, J. (1988), "Multichip Technology—Something for everyone?", Microelectronics International, Vol. 5 No. 3, pp. 2-3. https://doi.org/10.1108/eb044331