New products
27
Abstract
Augat/Isotronics now offer injection moulded, glass‐to‐metal sealed hybrid circuit packages providing many advantages over conventional machined components.
Citation
(1988), "New products", Microelectronics International, Vol. 5 No. 2, pp. 92-95. https://doi.org/10.1108/eb044330
Publisher
:MCB UP Ltd
Copyright © 1988, MCB UP Limited