TY  - JOUR
AB  - This paper describes a newly developed Copper PTF (Polymer Thick Film) which is characterised by direct solderability and high electrical conductivity. This Copper PTF claims to solve various problems existing in the conventional subtractive or firing process. It also realises new circuit production processes which are difficult to attain if conventional methods are applied.
VL  - 5
IS  - 2
SN  - 1356-5362
DO  - 10.1108/eb044322
UR  - https://doi.org/10.1108/eb044322
AU  - Tsunaga M.
AU  - Kato S.
PY  - 1988
Y1  - 1988/01/01
TI  - Present State of Directly Solderable Copper PTF
T2  - Microelectronics International
PB  - MCB UP Ltd
SP  - 32
EP  - 35
Y2  - 2024/04/16
ER  -