Temperature Cycling of Surface Mounted Thick Film ‘Zero‐ohm’ Jumpers

Abstract

Thermal cycling tests for surface mounted components are usually taken around a mean temperature of approximately 35°C (e.g., −55°C to +125°C; −40°C to +110°C). To test the effect of different maximum temperatures thermal cycling tests using a lower temperature of −55°C have been conducted with alumina/thick film ‘zero‐ohm’ jumper chips with nickel barriers. These are connected in series chains and wave soldered on to FR‐4 test coupons (128 chips/coupon). The test regimes used were −55°C to +5°C; +65°C; +95°C, +110°C and +125°C. Resistance changes before and after cycling were observed at room temperature. After 100 cycles changes of approximately +200 mΩ were observed against a total resistance of 5·5 Ω. However, more detailed examination showed that a top temperature of +95°C gives optimum results with a total change over 100 cycles of +4·9%.

Citation

Whalley, D.C. and Campbell, D.S. (1987), "Temperature Cycling of Surface Mounted Thick Film ‘Zero‐ohm’ Jumpers", Microelectronics International, Vol. 4 No. 3, pp. 68-70. https://doi.org/10.1108/eb044293