Conventional Techniques for the Production of High Density Interconnects
Article publication date: 1 March 1987
Screen printing for the fabrication of Thick Film microelectronic circuits is now a mature technology. A greater understanding of the processes and materials used has allowed the once ‘black art’ to develop into the high precision, high yield process of today—with circuits containing 250 µm conductors on many levels being printed over large areas up to 6 in. × 8 in. However, electronic systems designers are demanding more compact interconnections and screen printing technology must advance to meet this challenge. Encouraging research to date has demonstrated that 50 µm lines and spaces are readily printable under controlled conditions, and a complete 120 µm multilayer system is now a reality. Unfortunately, this rapid advance in the technology is likely to hit insurmountable barriers in the near future, and alternative patterning techniques may be required if Thick Film technology is to cope with the ultra high tracking densities that will soon be required.
Kidd, J. (1987), "Conventional Techniques for the Production of High Density Interconnects", Microelectronics International, Vol. 4 No. 3, pp. 34-37. https://doi.org/10.1108/eb044290
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