Article publication date: 1 February 1987
A new high precision reflow soldering/bonding machine, the Farco F‐130, ideal for automatically placing and accurately soldering surface mount devices such as flatpacks, chip carriers, SO and VSO components is available from Dage. TAB (Tape Automated Bonding) components can also be processed using the F‐130's modular system design which allows the machine to be more versatile in application.
(1987), "New products", Microelectronics International, Vol. 4 No. 2, pp. 110-112. https://doi.org/10.1108/eb044283
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