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Notes on the Effects of Metallisation of Surface Mounted Components on Soldering

R.J. Klein Wassink (SMD‐Technology Centre of Philips Centre for manufacturing Technology, Eindhoven, The Netherlands)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 February 1987

41

Abstract

Some characteristics of the metallisation of leadless ceramic components are discussed, such as dissolution, reliability of joints, intermetallic compound formations and the migration of silver. It is concluded that it is not the type of the metallisation that is important, but the quality of the make.

Citation

Klein Wassink, R.J. (1987), "Notes on the Effects of Metallisation of Surface Mounted Components on Soldering", Microelectronics International, Vol. 4 No. 2, pp. 9-12. https://doi.org/10.1108/eb044269

Publisher

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MCB UP Ltd

Copyright © 1987, MCB UP Limited

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