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Noble Steel: A Suitable Substrate Material in Thick Film Technology?

M. Budweit (Philips GmbH Forschungslaboratorium Hamburg, Hamburg, W. Germany)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 March 1986



In various publications noble steel is mentioned as a possibility for use as a substrate in thick film technology processing. The possibility to cut, stencil and drill steel sheets to desired shapes and the attractive price difference compared with alumina as well as PC board materials justified an investigation. A variety of steel sheets in various formulations from various vendors is offered on the market as well as ceramic pastes for thick film applications. This investigation aims to find out the most suitable ceramic paste for coating steel substrates in a common thick film process.


Budweit, M. (1986), "Noble Steel: A Suitable Substrate Material in Thick Film Technology?", Microelectronics International, Vol. 3 No. 3, pp. 30-35.




Copyright © 1986, MCB UP Limited

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