Substrate Bowing of Multilayer Thick Film Circuits

Abstract

The production of interconnection modules with an increasing number of layers leads to problems in the planarity of modules and therefore in the chip mounting process. The present paper discusses a model based on the theory of plates which allows the calculation of bowing degree in relation to the coefficients of thermal expansion αi, Young's moduli Ei, the thicknesses hi, and the softening point of the glassy components in the thick film pastes. The calculated values are compared with experimental data for substrates built up as entirely covered model substrates of up to 7 layers of one type of paste (conductor and dielectric, respectively) and of alternately printed layers.

Citation

Storbeck, I., Balke, H. and Wolf, M. (1986), "Substrate Bowing of Multilayer Thick Film Circuits", Microelectronics International, Vol. 3 No. 3, pp. 21-23. https://doi.org/10.1108/eb044243