Silicon Substrates for Chip Interconnection

Abstract

Through the use of silicon‐on‐silicon packaging, VLSI chips can be interconnected by dense contacts and very fine conductor lines. Electrical and thermal properties obtained by means of this technique are discussed. The fabrication of small cooling channels in the silicon substrate and the application of the anodic bonding technique for chip mounting are demonstrated.

Citation

Reichl, H. (1986), "Silicon Substrates for Chip Interconnection", Microelectronics International, Vol. 3 No. 3, pp. 5-7. https://doi.org/10.1108/eb044238