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Special reports

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 February 1986

26

Abstract

The Deutscher Verband für Schweisstechnik (German Welding Society) made a very judicious and much appreciated choice of venue for its Third International Conference on 18–20 February, 1986, on Interconnection Technology in Electronics. Fellbach, less than 10 km from the Schlossplatz in Stuttgart, and whose past profile was shaped almost entirely by winegrowing, has become since the opening in 1976 of the Schwabenlandhalle a town renowned equally for its significance as a conference centre. With the vine‐crowned Kappelberg hill dominating the town and commanding views to the Neckar Valley, Swabian hospitality and friendliness at its best, and a most impressive congress hall with excellent facilities in picturesque snow‐clad surroundings, the ingredients for providing a conference venue conducive to an optimum interchange of technological information were certainly present.

Citation

(1986), "Special reports", Microelectronics International, Vol. 3 No. 2, pp. 98-101. https://doi.org/10.1108/eb044235

Publisher

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MCB UP Ltd

Copyright © 1986, MCB UP Limited

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