Successive over‐relaxation methods have been applied to solutions of Poisson's equation for temperature distribution analysis of a number of metal reinforced and metal cored thick film substrate models. These include aluminium and copper clad invar reinforced alumina as well as dielectric coated steel and titanium substrates. The results of the computer analyses have been compared in some instances with actual measurements of temperature distributions in real structures. Some detailed inconsistencies have been found but good correlation has been shown in terms of ranked effectiveness.
Bilson, R., Allen, R., McCarthy, J. and Stanley, A. (1986), "Thermal Management Evaluation of Large Size Thick Film Hybrids", Microelectronics International, Vol. 3 No. 2, pp. 65-67. https://doi.org/10.1108/eb044230Download as .RIS
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